About Daniel Böck
University of Applied Sciences Technikum Wien
Department of Electronic Engineering
Research Group Embedded Systems
Höchstädtplatz 6
A-1200 Wien, Austria
Daniel Böck attended the HTBL-Hollabrunn and started his electronics engineering education at the University of Applied Scinces Technikum Wien in 2014. In 2017 he joined the Josef Ressel Center for Verification of Embedded Computimng Systems (VECS) where he worked in close collaboration with Loytec electronics GmbH until 2018.