Austrochip

Austrochip 2019

27th Austrian Workshop on Microelectronics
October 24, 2019 - Vienna, Austria

FH Technikum Wien
Research Group
Embedded Systems

Organizing Committee

  • Peter Rössler (General and Technical Program Chair), FH Technikum Wien
  • Christian Fibich (Organization Chair), FH Technikum Wien
  • Thomas Polzer (Publication Chair), FH Technikum Wien
  • Patrick Schmitt (Publicity Chair), FH Technikum Wien

Steering Committee

  • Mario Huemer, Institute of Signal Processing, Johannes Kepler University Linz
  • Michael Hutter, Rambus Technologies
  • Manfred Ley, Carinthia University of Applied Sciences, Villach
  • Timm Ostermann, Institute for Integrated Circuits, Johannes Kepler University Linz
  • Peter Rössler, Research Group Embedded Systems, University of Applied Sciences Technikum Wien
  • Kerstin Schneider-Hornstein, Inst. of Electrodynamics, Microwave & Circuit Engineering, Vienna Univ. of Technology
  • Peter Söser, Institute of Electronics, Graz University of Technology
  • Andreas Steininger, Institute of Computer Engineering, Vienna University of Technology

Technical Program Committee

  • Mario Auer, Institute of Electronics, Graz University of Technology
  • Alexander Bergmann, Institute of Electronic Sensor Systems, Graz University of Technology
  • Bernd Deutschmann, Institute of Electronics, Graz University of Technology
  • Dieter Draxelmayr, Infineon Technologies Austria
  • Martin Horauer, Research Group Embedded Systems, University of Applied Sciences Technikum Wien
  • Mario Huemer, Institute of Signal Processing, Johannes Kepler University Linz
  • Michael Hutter, Rambus Technologies
  • Nikolaus Kerö, Oregano Systems
  • Hans-Peter Kreuter, Infineon Technologies Austria
  • Manfred Ley, Carinthia University of Applied Sciences, Villach
  • Christian Netzberger, FH Joanneum, University of Applied Sciences, Kapfenberg
  • Burkhard Neurauter, eesy-ic
  • Timm Ostermann, Institute for Integrated Circuits, Johannes Kepler University Linz
  • Harald Pretl, Institute for Integrated Circuits, Johannes Kepler University Linz
  • Peter Rössler, Research Group Embedded Systems, University of Applied Sciences Technikum Wien
  • Gregor Schatzberger, ams AG
  • Kerstin Schneider-Hornstein, Inst. of Electrodynamics, Microwave & Circuit Engineering, Vienna Univ. of Technology
  • Peter Söser, Institute of Electronics, Graz University of Technology
  • Andreas Steininger, Institute of Computer Engineering, Vienna University of Technology
  • Johannes Sturm, Carinthia University of Applied Sciences, Villach
  • Gunter Winkler, Institute of Electronics, Graz University of Technology
  • Johannes Wolkerstorfer, xFace, Graz
  • Horst Zimmermann, Inst. of Electrodynamics, Microwave & Circuit Engineering, Vienna University of Technology